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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Omicure™

Adhesives ingredients supplied by Emerald Performance Materials

21 products match your search
Product Name
Supplier
Description
Emerald Performance Materials
Omicure™ BC-120 by Emerald Performance Materials is boron trichloride amine complex designed for adhesive applications. Used as a latent curing agent and accelerator in the aromatic amine, acid... view more
Applications
Emerald Performance Materials
Non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. Used an accelerator for anhydrides or as the sole hardener for catalytic cures of high temperature epoxy resin for laminating adhesives... view more
Emerald Performance Materials
High temperature aromatic amine. Used as a curing agent for epoxy and as a polyurethane crosslinking accelerator in electronic adhesives. Possesses low ionic level. Provides high compressive... view more
Emerald Performance Materials
Micronized dicyandiamide. Used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic Potting and encapsulating compounds. Can be catalyzed with other latent... view more
Emerald Performance Materials
Crystalline dicyandiamide. Used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting compounds... view more
Emerald Performance Materials
Ultra micronized dicyandiamide. Used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting compounds. Provides very good stability... view more
Emerald Performance Materials
Micronized dicyandiamide. Used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting compounds. Can be catalyzed with other latent... view more
Emerald Performance Materials
Monuron N-(4-chlorophenyl) - N, N-dimethyl urea. Acts as a reinforcing agent and latent accelerator for the dicyandiamide cure of epoxy resins. An ingredient in which Omicure™ U-210 is insoluble at... view more
Emerald Performance Materials
Monuron N-(4-chlorophenyl) - N, N-dimethyl urea. Acts as a reinforcing agent and latent accelerator for the dicyandiamide cure of epoxy resins. It represents the micronized grade of Omicure™ U-210... view more
Emerald Performance Materials
Aromatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Provides great degree of acceleration to... view more
Emerald Performance Materials
Micronized aromatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Provides great degree of... view more
Emerald Performance Materials
Cycloaliphatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Provides long room temperature shelf... view more
Emerald Performance Materials
Micronized cycloaliphatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Provides long room... view more
Emerald Performance Materials
Phenyl Dimethyl Urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Does not contain any chlorine. Use level : <5... view more
Emerald Performance Materials
Micronized aromatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Does not contain any chlorine... view more
Emerald Performance Materials
Aromatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Provides great degree of acceleration to... view more
Emerald Performance Materials
Micronized aromatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Provides great degree of... view more
Emerald Performance Materials
Aromatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Provides good acceleration, long shelf life... view more
Emerald Performance Materials
Micronized aromatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Provides good acceleration, long... view more
Emerald Performance Materials
Aromatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Provides good acceleration, long shelf life... view more
Emerald Performance Materials
Micronized aromatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. Reduces time and temperature of curing. Provides good acceleration, long... view more
Nagase Water Soluble Epoxy Compounds
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