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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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TEGOPAC®

Adhesives ingredients supplied by Evonik

7 products match your search
Product Name
Supplier
Description
TEGOPAC® RD 1 by Evonik is a silane-modified polymer used to decrease viscosity of adhesives & sealant formulations. It acts as a cross-linker which releases ethanol during the curing process. It... view more
TEGOPAC® Bond 170 by Evonik is a silylated polymer used for producing neutral curing adhesives and sealants with PPG as the backbone polymer. Applications include liquid membranes (for roofing... view more
TEGOPAC® RD 2 by Evonik is a silane-modified polymer. It acts as a cross-linker which releases ethanol during the curing process with a high cross-linking density: in combination with a co-binder a... view more
TEGOPAC® Bond 150 by Evonik is a plasticizer-free & solvent-free silane-terminated polymer with PPG backbone. It exhibits combination of outstanding through-cure & in-depth cure, excellent elastic... view more
TEGOPAC® Bond 160 by Evonik is a silylated polymer used for producing neutral curing adhesives and sealants where low formulation viscosity or very high filler load is required. Applications include... view more
TEGOPAC® Bond 251 by Evonik is a silane modified hybrid polymer with a modified backbone that contains hydrophilic segments and lateral crosslinking groups. It is a plasticizer and solvent-free... view more
TEGOPAC® Seal 100 by Evonik is a moisture curing silane modified polymer with PPG as backbone. It is recommended for low modulus sealant formulations which are used in construction applications... view more
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