AEROSIL® 300 V by Evonik is a densified hydrophilic fumed silica grade. It acts as a rheology modifier. It exhibits optimal dispersion yielding best results in pronounced thickening and thixotropy... view more

AMICURE® CG-1400 by Evonik acts as a curing agent. It is a micronized grade of dicyandiamide containing 0.5% of an inert flow control additive to inhibit clumping and improve handling. It is... view more

Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient... view more

Amicure® UR-41 by Evonik acts as an accelerator for dicyandiamide cured epoxy resins. It provides longer pot life than standard substituted urea accelerators without increasing activation... view more

Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more

Amicure® UR10/30 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It acts as a curing agent. It provides rapid curing, high glass transition temperature, good... view more

Amicure® UR2T by Evonik is a substituted urea-based cure accelerator. It is used in one-pack paste and film adhesives. It possesses good flow properties. Amicure® UR2T offers benefits such as rapid... view more

Amicure® UR7/10 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It is a finely grounded version of Amicure® UR accelerator. It is supplied as a micro... view more

ANCAMINE® 2014AS by Evonik is a latent curing agent based on modified polyamine. It can also be used as accelerator for dicyandiamide (DICY). It offers extremely long pot life, to cure rapidly above... view more

ANCAMINE® 2014FG by Evonik is a fine-grind, modified polyamine-based latent curing agent. It can also be used as accelerator for dicyandiamide (DICY). It offers extremely long pot life, to cure rapidly... view more

ANCAMINE® 2337S by Evonik is modified aliphatic amine designed for use as a latent curing agent for epoxy resins. It is can be used as a sole curing agent or as a DICY co-cure accelerator with... view more

ANCAMINE® 2441 by Evonik is a modified polyamine based latent curing agent. It can also be used as an accelerator for dicyandiamide (DICY). It is used in one-component convection or induction... view more

Ancamine® 2442 by Evonik is a modified polyamine designed for use as a latent curing agent for one-component epoxy formulations. It can also be used to accelerate dicyandiamide (DICY). It provides... view more

CUREZOL® 2MZ Azine by Evonik acts as an anhydride curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. It is recommended for structural adhesives. The shelf life of... view more

CUREZOL® 2P4MZ by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is recommended for adhesives. The shelf life of CUREZOL® 2P4MZ is 3 years. Recommended... view more

CUREZOL® C17Z by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It offers good latency and rapid reactivity at elevated temperatures. CUREZOL® C17Z is... view more

Dicyanex® 1200 by Evonik is a micronized grade of dicyandiamide. It contains 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing... view more

Dicyanex® 325 by Evonik is a pulverized grade of dicyandiamide. It contains 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing... view more

Hi-Black 40B2 by Evonik is a conductive carbon black pigment. It is used in caulks for interior and exterior applications and in expansion joints. Hi-Black 40B2 provides coloring... view more

Imicure® AMI-2 by Evonik acts as a dicyandiamide accelerator and curing agent. It is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy... view more

Imicure® Imidazole by Evonik acts is an elevated-temperature curing agent for epoxy resins. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents. It is readily compatible... view more

3,3'4,4'-Benzophenonetetracarboxylic Dianhydride. Acts as a curative for epoxy resins. It has low mix viscosity which helps in an easier incorporation of additives. Has a variable pot life for... view more

3,3'4,4'-Benzophenonetetracarboxylic Dianhydride. Facilitates mixing in epoxy resins. Added as a co-monomer in polyimide synthesis in order to enhance thermal and fire resistance. Has a variable pot... view more

3,3',4,4'-Benzophenonetetracarboxylic dianhydride. Acts as a curative for epoxy resins. It has low mix viscosity which helps in an easier incorporation of additives. Has a variable pot life for... view more

3,3',4,4'-Benzophenonetetracarboxylic dianhydride. Added as a co-monomer in polyimide synthesis in order to enhance thermal and fire resistance. Has a variable pot life for optimal processing and an... view more

Pyromellitic dianhydride. Acts as a curative for epoxy resins. It has low mix viscosity which helps in an easier incorporation of additives. Has a variable pot life for optimal processing and... view more

Pyromellitic dianhydride. Added as a co-monomer in polyimide synthesis in order to enhance thermal and fire resistance. Has a variable pot life for optimal processing and an optimum purity and... view more

Rohagit® KF 720 F by Evonik is a high molecular weight cationic polyelectrolyte based on methacrylate quat. Rohagit® KF 720 F is used as a thickening agent for aqueous and aqueous-alcoholic... view more

SIPERNAT® 320 DS by Evonik is synthetic amorphous precipitated silica. It has good thickening and excellent flow improving properties. SIPERNAT® 320 DS is used in adhesive (auxiliary ingredient)... view more

SIPERNAT® 383 DS by Evonik is synthetic amorphous precipitated silica. It has good thickening and excellent flow improving properties. SIPERNAT® 383 DS is used in adhesive (auxiliary ingredient)... view more

SIPERNAT® 880 by Evonik is synthetic precipitated calcium silicate. It has good thickening and excellent flow improving properties. SIPERNAT® 880 is used as auxiliary in polychloroprene adhesives... view more

SIPERNAT® D 10 by Evonik is a milled, synthetic, amorphous, hydrophobic silica. It exhibits high methanol wettability, low surface area, high effectiveness, and ease of dispersion. It has a shelf... view more

Surfynol® 104S by Evonik acts as a non-ionic surfactant with good wetting and defoaming properties. It is used in water borne carpet backing adhesives and pressure sensitive adhesives. Surfynol®... view more

Surfynol® 500S by Evonik is a wetting agent. This surfactant possesses extended open time and workability. It is silicon-free as well as APEO-free. It offers outstanding pigment wetting and prevents... view more

Surfynol® MD-610S by Evonik acts as a highly effective powder defoamer. It is silicon-free as well as APEO-free. It combines the benefits of fast-acting defoaming with long-lasting deaeration at a... view more

Synthetic Resin CA by Evonik is a ketone-aldehyde condensation resin. It is used in nitrocellulose adhesives for bonding of textiles, leather, paper and similar substances. It offers benefits such... view more

TEGO® Antifoam P 205 by Evonik is a powder based on organo-modified siloxane. It used as an antifoam in dispersion powder for adhesives and sealing. TEGO® Antifoam P 205 provides destruction or... view more

VESTAMELT® 171 by Evonik is a high-viscosity polyamide hot-melt adhesive. It improves the resistance to strike back in pastes. It provides benefits such as very good adhesion, improved resistance to... view more

VESTAMELT® 230-P1 by Evonik is a copolyamide hotmelt adhesive. It offers high resistance to heat and low viscosity. It provides very good resistance to washing to 90°C, steam and dry-cleaning... view more

VESTAMELT® 250-P816 by Evonik is copolyamide Hotmail adhesive. It offers high resistance to heat and good adhesion. It provides very good resistance to washing to 90°C, steam and dry-cleaning. It... view more

VESTAMELT® 253 by Evonik is a thermoplastic copolyamide hot-melt adhesive. It offers benefits such as very good resistance to washing, resistance to sand-washing, good resistance to heat and low... view more

VESTAMELT® 350-P1 by Evonik is a thermoplastic copolyamide resin. It is a paste additive for low viscosity grades and improves the resistance to strike back. It is suitable for hot-melt adhesive... view more

VESTAMELT® 350-P2 by Evonik is a thermoplastic copolyamide resin. It is a paste additive for low viscosity grades and improves the resistance to strike back. It is suitable for hot-melt adhesive... view more

VESTAMELT® 350-P3 by Evonik is a multi-purpose copolyamide hotmelt adhesive. It is used in industrial textiles and garment industry. VESTAMELT® 350-P3 offers good resistance to heat and special... view more

VESTAMELT® 350-P4 by Evonik is a multi-purpose copolyamide hot-melt adhesive. It offers good resistance to heat. It provides good resistance to washing to 60°C, satisfactory resistance to steam and... view more

VESTAMELT® 350-P816 by Evonik is a multi-purpose copolyamide hot-melt adhesive. It offers good resistance to heat. It provides good resistance to washing to 60°C, satisfactory resistance to steam... view more

VESTAMELT® 4280 by Evonik is a thermoplastic copolyester hot-melt adhesive for textile bonding. It offers very good resistance to washing to 60° and steam and good resistance to dry-cleaning... view more

VESTAMELT® 430-P1 by Evonik is a thermoplastic copolyamide hot-melt adhesive. It is used in pressure-sensitive and thermally sensitive face fabrics. VESTAMELT® 430-P1 offers benefits such as low... view more

VESTAMELT® 430-P2 by Evonik is thermoplastic copolyamide hot-melt adhesive. It possesses low melt viscosity. VESTAMELT® 430-P2 is used in good face fabrics and ladies wear... view more

VESTAMELT® 430-P816 by Evonik is a low melting temperature, low-viscosity copolyamide. It is used for manufacture of hot-melt adhesive for non-woven textile and nets. It provides good resistance to... view more

VESTAMELT® 4481-P1 by Evonik is a thermoplastic copolyester hot-melt adhesive for bonding textiles. It offers good resistance to washing to 60° and steam and satisfactory resistance to dry-cleaning... view more

VESTAMELT® 450-P1 by Evonik is thermoplastic copolyamide hot-melt adhesive. It offers benefits such as low melting point, low fusing temperature and good resistance to strike back... view more

VESTAMELT® 450-P2 by Evonik is a thermoplastic copolyamide hot-melt adhesive. It possesses low melting point, good resistance to strike back and low fusing temperature... view more

VESTAMELT® 450-P3 by Evonik is a thermoplastic copolyamide hot-melt adhesive. It offers benefits such as low melting point, good resistance to strike back and low fusing temperature. VESTAMELT®... view more

VESTAMELT® 4580-P1 by Evonik is thermoplastic copolyester hot-melt adhesive. It gives a wide fixing range. It offers good resistance to washing to 60° and dry-cleaning and very good resistance to... view more

VESTAMELT® 4580-P816 by Evonik is a thermoplastic copolyester hot-melt adhesive. It gives a wide fixing range. It offers good resistance to washing to 60°C and dry-cleaning and very good resistance... view more

VESTAMELT® 4581-P1 by Evonik is a thermoplastic copolyester hot-melt adhesive. It gives a wide fixing range. Offers good resistance to washing to 60° and dry-cleaning and very good resistance to... view more

VESTAMELT® 4680-P1 by Evonik is a thermoplastic copolyester hot-melt adhesive. It used for textile bonding. Gives low melting temperature. It offers good resistance to washing to 60°C and... view more

VESTAMELT® 4680-P2 by Evonik is a thermoplastic copolyester hot-melt adhesive. VESTAMELT® 4680-P2 offers benefits such as low fusing temperature, good adhesive strength and fusing with hand iron... view more

VESTAMELT® 4681-P1 by Evonik is a thermoplastic copolyester hot-melt adhesive. It is used for textile bonding. It gives low melting temperature. It offers good resistance to washing to 60°C and... view more

VESTAMELT® 470-P1 by Evonik is a copolyamide hot-melt adhesive. It offers benefits such as low melting point, high melt viscosity and improved resistance to strike back... view more

VESTAMELT® 471 by Evonik is a copolyamide hot-melt adhesive. It used in manufacture of films and in pastes, paste dot and powder dot. VESTAMELT® 471 offers improved resistance to strike back in... view more

VESTAMELT® 640-P1 by Evonik is a thermoplastic copolyamide hot-melt adhesive. It provides very low melting point for leather and furs... view more

VESTAMELT® 722 by Evonik is copolyamide hot-melt adhesive. It offers benefits such as low melting point and low viscosity for good adhesion on difficult surfaces... view more

VESTAMELT® 730 by Evonik is copolyamide hot-melt adhesive. It is used in paste dot, upper dot-DD, scattering, seating upholstery, difficult surfaces, shoulder padding, furs, aluminum films with... view more

VESTAMELT® 730-P1 by Evonik is copolyamide hot-melt adhesive. It provides benefits such as low melting point, low melt viscosity and very good adhesion to surfaces difficult to fuse and to silicon... view more

VESTAMELT® 730-P816 by Evonik is copolyamide hot-melt adhesive. It offers low melting point and low viscosity. Provides good resistance to washing to 60°C, satisfactory resistance to steam and very... view more

VESTAMELT® 730-P816/20 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as low melting point, low melt viscosity and very good adhesion to surfaces that are difficult to... view more

VESTAMELT® 750-P1 by Evonik is thermoplastic copolyamide hot-melt adhesives. It possesses good adhesion, good resistance to washing and dry cleaning and decreased tack after coating. VESTAMELT®... view more

VESTAMELT® 750-P2 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as low melting point, higher melt viscosity and good resistance to strike back. VESTAMELT® 750-P2 shows... view more

VESTAMELT® 750-P3 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as low melting point and good resistance to strike back. VESTAMELT® 750-P3 shows good adhesion to face... view more

VESTAMELT® 750-P816/20 by Evonik is a low melting temperature, copolyamide hot-melt adhesive. It offers good adhesion on difficult substrates. It provides good resistance to washing to 60°C... view more

VESTAMELT® 753 by Evonik is copolyamide hot-melt adhesive. It used in textile, automotive, electronics and construction industry... view more

VESTAMELT® 755-P1 by Evonik is copolyamide hot-melt adhesive. It provides benefits such as low melting point, high melt viscosity, good resistance to strike back and well adapted to substrates with... view more

VESTAMELT® 755-P2 by Evonik is a low melting temperature copolyamide hot-melt adhesive. It offers high resistance to strike back. It provides good resistance to washing to 60°C, satisfactory... view more

VESTAMELT® 840-P1 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as medium melt viscosity, wide fusing range, high resistance to steam and multipurpose. VESTAMELT® 840-P1... view more

VESTAMELT® 840-P2 by Evonik hot-melt adhesive. It provides benefits such as wide fusing range, high resistance to steam, good adhesion strength and multipurpose grade for different interlinings... view more

VESTAMELT® 840-P816 by Evonik is copolyamide hot-melt adhesive. It provides very good resistance to washing to 60°C, steam and dry-cleaning. It contains an optical brightening agent. VESTAMELT®... view more

VESTOWAX® AE 2 by Evonik is polyethylene wax ester. It is used in hot-melt adhesives as dispersing aid for dyes... view more

VESTOWAX® H 2050 MG by Evonik is fischer-tropsch oxidate wax. It is used in hot-melt adhesives as dispersing aid for dyes. It improves crystallinity and melting point. VESTOWAX® H 2050 MG reduces... view more

VESTOWAX® SH 112 by Evonik is fischer-tropsch oxidate wax. It is used in hot-melt adhesives as dispersing aid for dyes. It improves crystallinity and melting point. VESTOWAX® SH 112 reduces... view more

Versalink® 740 M by Evonik acts as a high performance diamine curing agent. It is a non-hazardous, off-white powder with wide processing latitude. It has a melting range of 125-128°C and should be... view more

Zeothix® 265 by Evonik is a micronized precipitated silica. It acts as a rheology modifier. It is suitable for both solvent-borne and solvent-free systems. It provides film uniformity, edge coverage... view more