EPICLON® 153 by DIC Corporation is an epoxy resin based on tetrabromobisphenol A grade. Acts as an excellent flame retardant. EPICLON® 153 is used in adhesive applications... view more

EPICLON® 1650-75MPX by DIC Corporation is a flexible epoxy resin. It can be diluted in xylene/ methoxypropanol solution. Exhibits improved impact resistance. EPICLON® 1650-75MPX is used in adhesive... view more

EPICLON® 520 by DIC Corporation is a 100% reactive diluent, alkyl phenol mono glycidyl ether. It achieves very lower viscosity when mixed with liquid epoxy resins. EPICLON® 520 is used in concrete... view more

Bisphenol F type epoxy resin. It is a liquid resin having excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more

EPICLON® 830-S by DIC Corporation is Bisphenol-F based epoxy resin. It contains low hydrolyzable chlorine content. Exhibits excellent workability and moldability due to low viscosity. EPICLON® 830-S... view more

Bisphenol F type epoxy resin. It has low tendency for crystallization. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more

EPICLON® 840 by DIC Corporation is a low viscosity bisphenol A type (BPA) epoxy resin. Available in Asian countries. Applications of EPICLON® 840 by DIC Corporation include concrete adhesives... view more

Bisphenol A type (BPA) epoxy resin. It is a liquid resin comprising low hydrolyzable chlorine. Available in Asian countries. Applications include concrete adhesives... view more

EPICLON® 850 by DIC Corporation is a standard bisphenol-A type epoxy resin. EPICLON® 850 is designed for concrete adhesives... view more

EPICLON® 850-CRP by DIC Corporation is a high purity, distilled bisphenol-A type (BPA) epoxy resin. Applications of EPICLON® 850-CRP include concrete adhesives... view more

Bisphenol A type (BPA) epoxy resin. It is a liquid resin which exhibits low tendency to crystallize. Available in Asian countries. Applications include concrete adhesives... view more

EPICLON® 850-S by DIC Corporation is a bisphenol A type (BPA) epoxy resin containing low hydrolyzable chlorine. Available in Asian countries. Applications of EPICLON® 850-S by DIC Corporation... view more

Epoxy resin diluted with butyl glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives... view more

Epoxy resin diluted with alkyl phenol mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives... view more

EPICLON® 860 by DIC Corporation is a bisphenol A (BPA) epoxy resin. EPICLON® 860 is used in adhesive applications... view more

Polyamine (amide amine). Acts as a curing agent. Offers high strength. Suitable for low temperature applications. Applications include concrete adhesives... view more

Epoxy resin diluted with alkyl phenol mono-glycidyl ether and alkyl mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications... view more

Epoxy resin diluted with 1, 6-hexanediol diglycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives... view more

EPICLON® EXA-4816 by DIC Corporation is a high purity epoxy resin. Exhibits excellent flexible toughness, high strength and elongation rate at normal temperatures. Offers tough physical properties... view more

EPICLON® EXA-4850-1000 by DIC Corporation is a high performance liquid epoxy resin with ductility and flexible toughness. It combines exceptionally good bonding properties and extremely small cure... view more

EPICLON® EXA-4850-150 by DIC Corporation is a high performance liquid epoxy resin with flexible toughness and ductility. It improves hard and brittle properties. It combines exceptionally good... view more

EPICLON® EXA-830LVP by DIC Corporation is a high purity, low viscosity Bisphenol-F based epoxy resin. Exhibits excellent workability and moldability due to low viscosity. Applications of EPICLON®... view more

Bisphenol F type epoxy resin. It is a resin of high purity. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more

EPICLON® HP-4032D by DIC Corporation is a high performance distilled naphthalene-based epoxy resin. It is a distilled product designed for liquid encapsulant applications in adhesives. Offers... view more

EPICLON® HP-4700 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4700 combines... view more

EPICLON® HP-4770 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4770 combines... view more

EPICLON® HP-5000 by DIC Corporation is a high performance epoxy resin with modified polyfuctional-type naphthalene backcone. Provides ductility and flexible toughness. It improves hard and brittle... view more

EPICLON® HP-6000 by DIC Corporation is a flame retardant, high performance epoxy resin with naphthalene backcone. Provides low thermal expansion, ductility and flexible toughness. It improves hard... view more

EPICLON® HP-7200 by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Exhibits ductility and flexible toughness. It combines exceptionally good bonding properties and... view more

EPICLON® HP-7200H by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Possesses ductility and flexible toughness. It combines exceptionally good bonding properties and... view more

EPICLON® HP-7200HH by DIC Corporation is a high performance dicyclopentadiene based epoxy resin. Designed for use in IC encapsulant and adhesives. Exhibits ductility and flexible toughness. EPICLON®... view more

EPICLON® HP-7200HHH by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Offers ductility and flexible toughness. It combines exceptionally good bonding properties and... view more

EPICLON® HP-7200L by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Designed for IC encapsulant applications in adhesives. It combines exceptionally good bonding... view more

EPICLON® HP-820 by DIC Corporation is a high performance liquid epoxy resin with alkyl phenol. Designed for use in adhesive applications. Exhibits ductility and flexible toughness. EPICLON® HP-820... view more

EPICLON® N-740 by DIC Corporation is a multifunctional phenol novolac-based epoxy resin. It is produced by reaction of phenol with formaldehyde and subsequent glycidylation with epichlorohydrin... view more

EPICLON® TSR-601 by DIC Corporation is a 100% solid, elastomer modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. EPICLON® TSR-601 is used in adhesive... view more

EPICLON® TSR-960 by DIC Corporation is a modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. EPICLON® TSR-960 is used in elastomeric modified adhesives... view more

HYDRAN™ GP-100 by DIC Corporation is an aliphatic, environment-friendly, waterborne polyurethane resin. It exhibits wet lamination, aging-free and no cross linker film properties. It helps to reduce... view more

HYDRAN™ GP-500 by DIC Corporation is an aromatic, environment-friendly, waterborne polyurethane resin. It possesses dry lamination, long pot-life and no cross linker film properties. It helps to reduce... view more

LUCKAMIDE 17-202 by DIC Corporation is a solvent solution of polyamide amine grade with drying characteristics. Acts as a curing agent for epoxy resin. LUCKAMIDE 17-202 is diluted with xylene and... view more

LUCKAMIDE EA-330 by DIC Corporation is a general purpose, solvent-less, polyamide amine grade. Acts as a curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE EA-330 is used... view more

LUCKAMIDE F4 by DIC Corporation is a general purpose, mannich-type modified aliphatic polyamine grade. Acts as a curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE F4 is... view more

LUCKAMIDE TD-960 by DIC Corporation is a general purpose, solvent-less, polyamide amine grade. Acts as a fast curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE TD-960 is... view more

LUCKAMIDE TD-961 by DIC Corporation is a solvent solution of polyamide adduct. Acts as a curing agent. Exhibits chemical resistance with drying characteristics. Shows compatibility with room... view more

LUCKAMIDE TD-977 by DIC Corporation is a solvent solution of polyamide amine adduct grade with drying characteristics. Acts as a curing agent. Shows compatibility with room temperature epoxy resin... view more

LUCKAMIDE TD-982 by DIC Corporation is a solvent-free, polyamide amine grade. Acts as a curing agent for room temperature epoxy resin. It is useable for long period of time. TD-982 is used as an... view more

LUCKAMIDE TD-984 by DIC Corporation is a solvent-less, polyamide amine grade. Acts as a curing agent. It is useable for long period of time. Shows compatibility with room temperature epoxy resin... view more

LUCKAMIDE TD-992 by DIC Corporation is a solvent solution of polyamine adduct with drying characteristics. Acts as a curing agent for room temperature epoxy resin. LUCKAMIDE TD-992 is diluted with... view more

LUCKAMIDE WH-614 by DIC Corporation is a mannich-type modified aliphatic polyamine grade with bonding properties. Acts as a curing agent for room temperature epoxy resin. LUCKAMIDE WH-614 is used as... view more

LUCKAMIDE WH-650 by DIC Corporation is a high strength, modified aliphatic polyamine grade. Acts as a fast curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE WH-650 is... view more

LUCKAMIDE WN-405 by DIC Corporation is a mannich-type modified aliphatic polyamine grade. Acts as a fast curing agent for room temperature epoxy resin. LUCKAMIDE WN-405 exhibits acid resistance... view more

LUCKAMIDE WN-620 by DIC Corporation is a modified aliphatic polyamine grade with high strength. Acts as a fast curing agent for room temperature epoxy resin. LUCKAMIDE WN-620 is used as an... view more

Megaface® EFS-131 by DIC Corporation is PFAS-free, environment-friendly surfactant. It has a high surface tension reduction ability equal to or higher than that of fluorine-based products, and excellent uniform... view more

Megaface® EFS-321 by DIC Corporation is PFAS-free, environment-friendly, high-performance surfactant for adhesive applications. It has a high surface tension reduction ability equal to or higher than that of... view more

Megaface® EFS-521 by DIC Corporation is PFAS-free, environment-friendly surfactant suitable for adhesive applications. It is an ideal alternative to fluorosurfactant. It has a high surface tension reduction... view more

Megaface® EFS-801 by DIC Corporation is PFAS-free surfactant for adhesive applications. It provides very good surface smoothness. It has a high surface tension reduction ability equal to or higher than that of... view more

PHENOLITE LA-1356 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Provides high heat-, moisture- and chemical resistance. It can be diluted in methyl ethyl... view more

PHENOLITE LA-3018-50P by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Offers high heat-, moisture- and chemical resistance. It can be diluted in PGM solution... view more

PHENOLITE LA-7052 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. It can be diluted in methyl ethyl ketone. Offers high heat-, moisture- and chemical... view more

PHENOLITE LA-7054 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Possesses high heat-, moisture- and chemical resistance. Shows compatibility with epoxy... view more

PHENOLITE LA-7751 by DIC Corporation is an ATN-type novolac phenol resin which exhibits high cross-linking density. Offers high heat-, moisture- and chemical resistance. Shows compatibility with... view more

PHENOLITE TD-2090 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Exhibits softening point at 117-123°C and high cross-linking density. Shows high heat-, moisture- and... view more

PHENOLITE TD-2091 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Offers softening point at 105-115°C and high cross-linking density. Shows high heat-, moisture- and... view more

PHENOLITE TD-2093 by DIC Corporation is a phenolic novolac resin. Provides softening point at 98-102°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE... view more

PHENOLITE TD-2106 by DIC Corporation is a phenolic novolac resin. Offers softening point at 88-95°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE... view more

PHENOLITE TD-2131 by DIC Corporation is phenolic novolac resin. Exhibits high cross-linking density as well as high heat-, moisture- and chemical resistance. Compatible with epoxy resin curing... view more

PHENOLITE VH-4150 by DIC Corporation is a bisphenol A novolac resin designed for encapsulants. Exhibits softening point at 85-89°C and high cross-linking density. Shows high heat-, moisture- and... view more

PHENOLITE VH-4170 by DIC Corporation is a bisphenol A novolac resin. Exhibits softening point at 103-108°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance... view more

UNIDIC V-8000 by DIC Corporation is a solvent-soluble amide-imide resin which contain rigid imide structures and terminal carboxyl groups. Acts as a hardening agent for epoxy resins. Provides high... view more

UNIDIC V-8002 by DIC Corporation is a solvent-soluble amide-imide resin. Acts as a hardening agent. It contains rigid imide structures and terminal carboxyl groups. Designed for heat-resistant... view more

UNIDIC V-8005 by DIC Corporation is a solvent-soluble amide-imide resin, containing terminal carboxyl groups and rigid imide structures . Acts as a hardening agent. Provides high mechanical... view more