The material selection platform
Adhesives Ingredients
OK
The material selection platform
Adhesives Ingredients
Welcome back
,
My Profile
My Subscriptions
My Courses & Tutorials
Logout
Subscribe to Newsletters
Login / Register
The material selection platform
Adhesives Ingredients
Ingredients Selector
Selection Resources
News & Feeds
SEARCH
OK
Home
Search site
Products Search
by SpecialChem
Share
Feedback
Get link
Copy
Save
Cette page a bien été ajoutée à vos favoris
View all pages saved
CONTINUE BROWSING
Products (
511
)
Documents (
3
)
News (
24
)
REFINE YOUR SEARCH
(
active filters)
28
products match your search
Detailed
List
Product Name
Supplier
Description
Omicure® U-24M
Huntsman
Omicure® U-24M by Huntsman is an aromatic substituted urea, intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It is suitable for encapsulation adhesives. The...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-35M
Huntsman
Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-405M
Huntsman
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-410M
Huntsman
Omicure® U-410M by Huntsman is micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-415M
Huntsman
Omicure® U-415M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-52M
Huntsman
Omicure® U-52M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It is reduces time and temperature of...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
PKHP-200 POWDER
Huntsman
PKHP-200 POWDER by Huntsman is a micronized, phenoxy resin. It is a tough, ductile, amorphous polymer having excellent thermal stability, adhesion and cohesion strength, and excellent vapor barrier...
view more
Applications
Adhesives
Sealants
Phenoxy PK™ HP-80
Huntsman
Phenoxy PK™ HP-80 by Huntsman is a tough, ductile, amorphous, low viscosity phenoxy (poly hydroxyl ethers) resin. It offers excellent thermal stability, adhesive strength, and vapor barrier...
view more
Applications
Adhesives
Sealants
1
2
Back to Top