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Adhesives Ingredients
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Adhesives Ingredients
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Description
Genamid® 235
BASF
Genamid® 235 by BASF is low viscosity amidoamine resin. Used as curing agent for solid or liquid epoxy resins. Offers good compatibility with a wide range of epoxy products. Suits for high solids...
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Applications
Adhesives
Polymers>Epoxies (EP)
Genamid® 250
BASF
Genamid® 250 by BASF is a low viscosity amidoamine resin. Used as a curing agent for solid or liquid epoxy resins in adhesives. Offers good compatibility with a wide range of epoxy products and is...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
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