AMICURE® CG-1400 by Evonik acts as a curing agent. It is a micronized grade of dicyandiamide containing 0.5% of an inert flow control additive to inhibit clumping and improve handling. It is... view more

Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient... view more

Amicure® UR-41 by Evonik acts as an accelerator for dicyandiamide cured epoxy resins. It provides longer pot life than standard substituted urea accelerators without increasing activation... view more

Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more

Amicure® UR10/30 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It acts as a curing agent. It provides rapid curing, high glass transition temperature, good... view more

Amicure® UR2T by Evonik is a substituted urea-based cure accelerator. It is used in one-pack paste and film adhesives. It possesses good flow properties. Amicure® UR2T offers benefits such as rapid... view more

Amicure® UR7/10 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It is a finely grounded version of Amicure® UR accelerator. It is supplied as a micro... view more

ANCAMINE® 2014AS by Evonik is a latent curing agent based on modified polyamine. It can also be used as accelerator for dicyandiamide (DICY). It offers extremely long pot life, to cure rapidly above... view more

ANCAMINE® 2014FG by Evonik is a fine-grind, modified polyamine-based latent curing agent. It can also be used as accelerator for dicyandiamide (DICY). It offers extremely long pot life, to cure rapidly... view more

ANCAMINE® 2337S by Evonik is modified aliphatic amine designed for use as a latent curing agent for epoxy resins. It is can be used as a sole curing agent or as a DICY co-cure accelerator with... view more

ANCAMINE® 2441 by Evonik is a modified polyamine based latent curing agent. It can also be used as an accelerator for dicyandiamide (DICY). It is used in one-component convection or induction... view more

Ancamine® 2442 by Evonik is a modified polyamine designed for use as a latent curing agent for one-component epoxy formulations. It can also be used to accelerate dicyandiamide (DICY). It provides... view more

Dicyanex® 1200 by Evonik is a micronized grade of dicyandiamide. It contains 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing... view more

Dicyanex® 325 by Evonik is a pulverized grade of dicyandiamide. It contains 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing... view more

Imicure® AMI-2 by Evonik acts as a dicyandiamide accelerator and curing agent. It is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy... view more

Imicure® Imidazole by Evonik acts is an elevated-temperature curing agent for epoxy resins. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents. It is readily compatible... view more

Surfynol® 104S by Evonik acts as a non-ionic surfactant with good wetting and defoaming properties. It is used in water borne carpet backing adhesives and pressure sensitive adhesives. Surfynol®... view more

Surfynol® 500S by Evonik is a wetting agent. This surfactant possesses extended open time and workability. It is silicon-free as well as APEO-free. It offers outstanding pigment wetting and prevents... view more

Surfynol® MD-610S by Evonik acts as a highly effective powder defoamer. It is silicon-free as well as APEO-free. It combines the benefits of fast-acting defoaming with long-lasting deaeration at a... view more