Genamid® 235 by BASF is low viscosity amidoamine resin. Used as curing agent for solid or liquid epoxy resins. Offers good compatibility with a wide range of epoxy products. Suits for high solids... view more

Genamid® 250 by BASF is a low viscosity amidoamine resin. Used as a curing agent for solid or liquid epoxy resins in adhesives. Offers good compatibility with a wide range of epoxy products and is... view more

Tinuvin® 622 is a high molecular weight oligomeric hindered amine by BASF. Used in hotmelt, reactive, solvent-based and radiation curing adhesives and sealants. Acts as a light stabilizer and... view more