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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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2 products match your search
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Genamid® 235 by BASF is low viscosity amidoamine resin. Used as curing agent for solid or liquid epoxy resins. Offers good compatibility with a wide range of epoxy products. Suits for high solids... view more
Genamid® 250 by BASF is a low viscosity amidoamine resin. Used as a curing agent for solid or liquid epoxy resins in adhesives. Offers good compatibility with a wide range of epoxy products and is... view more
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