BYK® -065 by BYK is a solution of foam-destroying polysiloxanes. Acts as a defoamer. This additive contains fluoro-modified silicone. It is preferably used in the chlorinated rubber, vinyl and... view more

BYK® -066 N by BYK is a solution of foam-destroying polysiloxanes. Acts as a defoamer. This additive contains fluoro-modified silicone. The binders preferred for it are chlorinated rubber and... view more

BYK® -067 A by BYK is a non-aqueous emulsion of a foam-destroying polysiloxane. Acts as a defoamer. In BYK® -067 A, separation or turbidity may occur at temperatures below 5°C. This additive is odor... view more

Ancamide® 3015 by Evonik is a high viscosity polyamide solution in xylene. It acts as a curing agent for solid epoxy resins. It provides good flexibility, high performance corrosion resistance and... view more

ERISYS® GE-10 by Huntsman is a low viscosity, aromatic, mono-epoxide, ortho cresol glycidyl ether. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses... view more

ERISYS® GE-21 by Huntsman is low viscosity, aliphatic, diepoxide, epoxidized butanediol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses compatibility at... view more

ERISYS® GE-22 by Huntsman is a low viscosity, cycloaliphatic diepoxide, epoxidized cyclohexanedimethanol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses... view more

ERISYS® GE-24 by Huntsman is a low viscosity, relatively high equivalent weight diepoxide of an aliphatic polyglycol. It is used as a diluent and flexibilizer in high viscosity, brittle epoxy... view more