B-Tough™ A1 by Cargill is an epoxy functional, reactive toughening agent with lowest polarity. It provides impact strength to structural adhesives without impacting the hardness of the matrix... view more

B-Tough™ A2 by Cargill is a low polarity, epoxy functional, reactive toughening agent. It offers impact strength to structural adhesives without impacting the hardness of the matrix. It protects... view more

B-Tough™ A3 by Cargill is a medium polarity, epoxy functional, reactive toughening agent. It provides impact strength to structural adhesives without impacting the hardness of the matrix. It... view more

Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more

Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more

CAB-O-SIL® TS-720 by Cabot is a hydrophobic fumed silica treated with polydimethylsiloxane (PDMS). It is characterized by medium surface area, high purity, aggregated structure, submicron particle... view more

CAB-O-SIL® TS-720D by Cabot is a medium surface area, densed form of fumed silica. It has been surface modified with polydimethylsiloxane. It is an outstanding choice for moisture-sensitive systems... view more

Polydimethylsiloxane treated fumed silica. Acts as a rheology modifier for adhesives requiring very high sag resistance and stable bond lines for structural adhesives... view more

Eastman™ Butyl Acetate by Eastman is a readily biodegradable, medium boiling ester solvent. It offers good solvent activity, high electrical resistance and low MIR value, surface tension and water solubility... view more

Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling... view more

Amicure® CG-1200G by Evonik is a micronized grade of dicyandiamide. It contains 0.5% of an inert flow control additive to inhibit clumping and improve handling. It acts as a latent curing agent. Its... view more

AMICURE® CG-325 by Evonik is a pulverized grade of dicyandiamide. It offers benefits such as enhanced reactivity, improved product consistency and reduced clumping. AMICURE® CG-325 is used as a curing agent... view more

Amicure® CG-325G is a micronized grade of dicyandiamide. It acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. It contains 1.5% of an inert flow... view more

Amicure® CG-NA by Evonik is an unpulverized grade of dicyandiamide. It is designed for use as a latent curing agent for epoxy resins in solvent-based processes. Amicure® CG-NA is suitable for... view more