Curekind® CuMDC(CDD) Dust free Powder is a copper dimethyl dithiocarbamate. Acts as a fast curing accelerator. It is compatible with SBR, butyl rubber and 4-polybutadiene rubber. Its dosage rate for... view more

Curekind® CuMDC(CDD) Powder is a copper dimethyl dithiocarbamate. Acts as a fast curing accelerator. It is compatible with SBR, butyl rubber and 4-polybutadiene rubber. Its dosage rate for SBR as... view more

Curekind® DPTT(TRA) Dust free Powder is a bis(pentamethylene)thiuram tetrasulfide. Acts as a vulcanizator and rubber accelerator. It is soluble in chloroform, benzene, acetone, carbon disulfide, a... view more

Curekind® DPTT(TRA) Powder is a bis(pentamethylene)thiuram tetrasulfide. Acts as a vulcanizator and rubber accelerator. It is soluble in chloroform, benzene, acetone, carbon disulfide, a little... view more

Curekind® TBBS(NS) Powder is a N-tert-butyl-2-benzothiazole sulfenamide. Acts as a delayed action vulcanization accelerator. Its vulcanizing speed is similar to CBS, but it's delaying is larger than... view more

Resicure™ 2-MI by A&C Catalysts is 2-methyl imidazole. It acts as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin-based formulations. It offers high chemical... view more

Dicyamdiamide. It acts as a curing agent. It appears as white to off-white powder. It is one of the finer of several pulverized grades of dicyandiamide containing more than 1% fumed silica as a flow... view more

Dicyamdiamide. It acts as curing agent. It appears as white to off-white powder. It is one of the finer of several pulverized grades of dicyandiamide containing more than 1% fumed silica as a flow... view more

Technicure® IPDU-8 by A&C Catalysts is a N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. Technicure® IPDU-8 is a dicyandiamide (DICY) cure... view more

Technicure® LC-100 by A&C Catalysts is an encapsulated modified imidazole designed for one-component epoxy formulations. It can be used as a sole curing agent or as an accelerator for dicyandiamide, anhydride... view more

Lonzacure® M-CDEA-PQ by Arxada is a chain extender for elastomeric polyurethanes and as a curing agent for epoxides. It provides very good dynamics, temperature-, chemical- and abrasion resistance... view more

PMDA Bopi grade by Arxada is a curing agent for epoxy resins used for the manufacture of adhesives. It offers great heat resistance and good electrical properties. It provides low volatility, high... view more

PMDA Granular by Arxada is a curing agent for epoxy resins used for the manufacture of adhesives. It offers great heat resistance and good electrical properties. It provides low volatility, high... view more

PMDA Ultrafine by Arxada is a curing agent for epoxy resins used for the manufacture of adhesives. It offers great heat resistance and good electrical properties. It provides low volatility, high... view more

Lapox® ASH-10 by Atul is a white to off-white, odorless, non-volatile crystalline powder. It acts as curing agent with epoxy resins specially to obtain slow reactivity and extended pot life of mix... view more

Lapox® ASH-10 FF by Atul is a curing agent with epoxy resins specially to obtain slow reactivity and extended pot life of mix. It is white to off-white, odorless, non-volatile crystalline powder... view more

Lapox® ASH-10 MIC by Atul is a non-volatile micronised powder suitable to disperse uniformly in epoxy resins. It acts as curing agent. Offers slow reactivity and extended pot life of mix. Exhibits... view more

Lapox® ASH-11 by Atul is a white to brownish, odorless, non-volatile crystalline powder. It is used as curing agent with epoxy resins specially to obtain faster reactivity than 4,4’-DDS. Exhibits... view more

Lapox® ASH-11 MIC by Atul is an aromatic amine curing agent with fast reactivity than 4,4’-DDS. It is off-white to yellowish-brown, odorless, non-volatile micronised powder suitable to disperse... view more

Irgamod™ 195 by BASF is calcium phosphonate used in adhesives. Acts as a high molecular weight stabilizer, (trans) esterification catalyst, property modifier and antioxidant for rubber applications... view more

Resorsabond® 4552 by Bakelite Synthetics is a hardener for phenol-resorcinol-formaldehyde resins. Used in adhesives for gluing irregular mating wood surfaces. Contains paraformaldehyde... view more

DODECANEDIOIC ACID by Corvay Specialty Chemicals acts as a curing agent in epoxy-based adhesives and sealants. It provides improved adhesion, strength, and resistance to moisture and chemicals. It is typically... view more

Sebacic Acid distributed by Corvay Specialty Chemicals acts as a curing agent. It is used in the production of adhesives and sealants. It is a long chain dicarboxylic acid, also known as decanedioic acid or DC10... view more

Undecanedioic Acid distributed by Corvay Specialty Chemicals acts as a curing agent. It is a long chain dicarboxylic acid, also known as DC11 or UDDA. It consists of an unbranched carbon backbone which offers... view more

Polyfunctional isocyanate. Acts as a curing agent. Provides higher heat resistance as well as a better chemical resistance for bonding adhesives by curing polyurethane- and polycaprolactone based... view more

AMICURE® CG-1400 by Evonik acts as a curing agent. It is a micronized grade of dicyandiamide containing 0.5% of an inert flow control additive to inhibit clumping and improve handling. It is... view more

Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient... view more

Amicure® UR-41 by Evonik acts as an accelerator for dicyandiamide cured epoxy resins. It provides longer pot life than standard substituted urea accelerators without increasing activation... view more

Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more

Amicure® UR10/30 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It acts as a curing agent. It provides rapid curing, high glass transition temperature, good... view more

1, 1, 1-Tris-hydroxy phenyl ethane. Acts as a crosslinking agent. Used in epoxies... view more

Latent hardener/accelerator 8000K by Guangzhou Guyan Electronic Material is adduct from imidazole and epoxy resin. It acts as latent hardener (curing agent) and accelerator. It is applied in epoxy resin field as hardener and accelerator of... view more

Latent hardener/accelerator HT110 by Guangzhou Guyan Electronic Material is an epoxy resin latent hardener(curing agent) and accelerator. It has properties such as less ratio in epoxy resin, high heat-resistance, brightening, and good electric... view more

It is an imidazole type latent hardener (curing agent) and accelerator for one-component epoxy resin compounds. It exists as yellowish powder. As accelerator, it can lower down hardening temperature... view more

Trially cyanurate. Acts as an effective co-agent or crosslinking agent for the peroxide cure. It gives higher yield on usage. Compatible with chlorinated rubber, EPDM, natural rubber, epoxy... view more

Aradur® 9506 by Huntsman is a latent modified polyamine hardener. It exhibits high reactivity above 100°C, low solubility and outstanding latency at room temperature when blended with epoxy resins... view more

Aradur® 9664-1 by Huntsman is a curing agent used with Araldite® epoxy resins. It is 4,4' diaminodiphenylsulfone grade. Exhibits excellent thermal stability and high temperature properties with... view more

Aradur® 976-1 by Huntsman is a 4,4' diaminodiphenylsulfone based high performance hardener used with Araldite® epoxy resins. It is an aero grade. Possesses excellent thermal stability, outstanding... view more

GABEPRO™ GPS-331 by Huntsman is a curing agent. It provides excellent thermal stability, outstanding chemical resistance, and excellent high-temperature properties. It requires the elevated... view more

Omicure® DDA 10 by Huntsman is micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic potting and encapsulating compounds... view more

Rhenocure® IS 6O by Lanxess is a vulcanizing agent in natural and synthetic rubber compounds for technical seals. Suits for applications in which sulphur bloom or infiltration of neighboring layers... view more

Rhenocure® IS 60-5 by Lanxess is an antidust- and vulcanizing agent in natural and synthetic rubber compounds for technical seals. Suits for applications in which sulphur bloom or infiltration of... view more

Rhenofit® 2060 by Lanxess is a curing activator and acid acceptor for adhesives based on CR. It is low active, fine particle sized magnesium oxide. Improves processing safety of rubber compounds... view more

Rhenofit® 2120 by Lanxess is an active magnesium oxide-based curing activator and acid acceptor for adhesives based on CR. Improves processing safety of rubber compounds based on CSM, CM and CIIR... view more

Rhenofit® BDMA/S by Lanxess is an activator for peroxide vulcanization in technical molded and extruded seals based on EPDM, EPM, NBR & CM. It is a blend of 1,4-butandioldimethacrylate and silica... view more

Magnesium oxide. Acts as a curing agent in neoprene/phenolic adhesives. It is a highly reactive micronized grade which is processed from magnesium-rich brine. Possesses high purity and high surface... view more

3,3'-Diaminodiphenylsulfone by Mitsui Chemicals is a curing agent. SO2 offers better performance in bonding carbon-fibers. Used for a heat-resistant epoxy resin. It offers flexibility... view more

4,4'-Diaminodiphenylether (4,4'-DADPE) by Mitsui Chemicals is an epoxy curing agent. It is suitable for thermosetting resin. 4,4'-Diaminodiphenylether (4,4'-DADPE) offers adhesive properties and... view more

4,4'-Diaminodiphenylsulfone by Mitsui Chemicals is used in epoxy resin as a curing agent. It provides excellent flexibility and heat resistance. SO2 offers better performance in bonding... view more

Diaminodihydroxysulfone by Mitsui Chemicals is a curing agent. SO2 offers better performance in bonding carbon-fibers. Used for epoxy resin. Diaminodihydroxysulfone offers photosensitivity and... view more

Bis (N, N’-2-hydroxyethyl) hexandiamine. Acts as a curing agent. Exhibits high curing capability, chemical resistance and excellent reaction activity. It is a TGIC-free white powder. Widely used in... view more

Tris (2, 3-Epoxypropyl) isocyanurate. Acts as a curing agent. Exhibits low UV absorption, high heat- and chemical resistance. Widely used in plastic and rubber adhesive additives... view more

LC-10 by Shin-A T&C is a latent hardner. LC-10 is available as a white color powder for adhesives applications... view more

LC-30 by SHIN-A T&C is a latent hardner. It is available as a white color powder for adhesives applications... view more