The material selection platform
Adhesives Ingredients
OK
The material selection platform
Adhesives Ingredients
Welcome back
,
My Profile
My Subscriptions
My Courses & Tutorials
Logout
Subscribe to Newsletters
Login / Register
The material selection platform
Adhesives Ingredients
Ingredients Selector
Selection Resources
News & Feeds
SEARCH
OK
Adhesives & Sealants Selector
Evonik
AMICURE®
by SpecialChem
Share
Feedback
Get link
Copy
Save
Cette page a bien été ajoutée à vos favoris
View all pages saved
CONTINUE BROWSING
REFINE YOUR SEARCH
(
active filters)
AMICURE®
Adhesives ingredients supplied by Evonik
15
products match your search
Detailed
List
Product Name
Supplier
Description
AMICURE® 101
Evonik
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
AMICURE® CG-1200G
Evonik
Amicure® CG-1200G by Evonik is a micronized grade of dicyandiamide. It contains 0.5% of an inert flow control additive to inhibit clumping and improve handling. It acts as a latent curing agent. Its...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
AMICURE® CG-1400
Evonik
AMICURE® CG-1400 by Evonik acts as a curing agent. It is a micronized grade of dicyandiamide containing 0.5% of an inert flow control additive to inhibit clumping and improve handling. It is...
view more
Applications
Polymers>Epoxies (EP)
AMICURE® CG-325
Evonik
AMICURE® CG-325 by Evonik is a pulverized grade of dicyandiamide. It offers benefits such as enhanced reactivity, improved product consistency and reduced clumping. AMICURE® CG-325 is used as a curing agent...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
AMICURE® CG-325G
Evonik
Amicure® CG-325G is a micronized grade of dicyandiamide. It acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. It contains 1.5% of an inert flow...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
AMICURE® CG-NA
Evonik
Amicure® CG-NA by Evonik is an unpulverized grade of dicyandiamide. It is designed for use as a latent curing agent for epoxy resins in solvent-based processes. Amicure® CG-NA is suitable for...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
AMICURE® DBU-E
Evonik
AMICURE® DBU-E by Evonik acts as a cure accelerator. It is a low ionic impurity grade of diazabicycloundecene which is an accelerator for phenolic novolac and other epoxy cures. It offers advantages...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
AMICURE® PACM
Evonik
AMICURE® PACM by Evonik is an unmodified cycloaliphatic amine-based curing agent. On heat-curing, it offers good resistance against acids, alkalis, water and hydrocarbon solvents. It possesses low...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
AMICURE® TEDA
Evonik
Amicure® TEDA by Evonik is a high-purity catalyst. It is designed for polyurethane applications. Amicure® TEDA consists of minimum 99.95% of triethylenediamine on a water-free, amine-base. It is...
view more
Applications
Adhesives>Water-based adhesives
Polymers>Polyurethanes>PU-Prepolymers
AMICURE® UR
Evonik
Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient...
view more
Applications
Adhesives>Film/ Web adhesives
Polymers>Epoxies (EP)
AMICURE® UR-41
Evonik
Amicure® UR-41 by Evonik acts as an accelerator for dicyandiamide cured epoxy resins. It provides longer pot life than standard substituted urea accelerators without increasing activation...
view more
Applications
Adhesives>Film/ Web adhesives
Polymers>Epoxies (EP)
AMICURE® UR-S
Evonik
Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high...
view more
Applications
Adhesives>Film/ Web adhesives
Polymers>Epoxies (EP)
AMICURE® UR10/30
Evonik
Amicure® UR10/30 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It acts as a curing agent. It provides rapid curing, high glass transition temperature, good...
view more
Applications
Adhesives>Film/ Web adhesives
Polymers>Epoxies (EP)
AMICURE® UR2T
Evonik
Amicure® UR2T by Evonik is a substituted urea-based cure accelerator. It is used in one-pack paste and film adhesives. It possesses good flow properties. Amicure® UR2T offers benefits such as rapid...
view more
Applications
Adhesives>Film/ Web adhesives
Polymers>Epoxies (EP)
AMICURE® UR7/10
Evonik
Amicure® UR7/10 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It is a finely grounded version of Amicure® UR accelerator. It is supplied as a micro...
view more
Applications
Adhesives>Film/ Web adhesives
Polymers>Epoxies (EP)
Spotlight
Webinar resources: Use of clay-based rheology additives for tiles
Discover strategies for better performance
Read More
Live webinar: Versatile clay-based construction rheology additives
Sign up for our webinar with Elementis' specialist
Read More
SMPs & Sustainability: Find out the connection
Elementis' SMP sealants
Read More
Maximize sustainability in SMP sealants with new rheology modifiers
Learn about new THIXATROL® Renewable Rheology Modifiers
Read More
Read More
A sustainable revolution for bio-based adhesives
Explore lignin, the sustainable solution
Read More
MS POLYMER™ and lignin fusion for sustainable elastic adhesives
This fusion enhances thermal stability and adhesion
Read More
Learn about Omya's commitment to fostering customer innovation
Supporting customer innovation
Read More
Looking for a rheological modifier with a low carbon footprint?
Discover Omyabond® 160
Read More
Discover Trinseo's acrylic adhesives: Connecting ideas with solutions
Trinseo aims to solve customers' unique challenges
Read More
Unveil novel adhesives for non-structural exterior wood applications
Delve into their cost-effectiveness
Read More
Back to Top