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Adhesives Ingredients
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Adhesives Ingredients
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Amicure®

Adhesives ingredients supplied by Evonik

15 products match your search
Product Name
Supplier
Description
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling... view more
Amicure® CG-1200G by Evonik is a micronized grade of dicyandiamide. It contains 0.5% of an inert flow control additive to inhibit clumping and improve handling. It acts as a latent curing agent. Its... view more
Amicure® CG-1400 by Evonik is a dicyandiamide based micronized curing agent. It is a 0.5% of an inert flow control additive to inhibit clumping and improve handling. It can be used as a latent... view more
Amicure® CG-325 by Evonik is a pulverized grade of dicyandiamide. It offers benefits such as enhanced reactivity, improved product consistency and reduced clumping. Amicure® CG-325 is used as a... view more
Amicure® CG-325G is a micronized grade of dicyandiamide. It acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. It contains 1.5% of an inert flow... view more
Amicure® CG-NA by Evonik is an unpulverized grade of dicyandiamide. It is designed for use as a latent curing agent for epoxy resins in solvent-based processes. Amicure® CG-NA is suitable for... view more
Amicure® DBU-E by Evonik is a low ionic impurity grade of diazabicycloundecene which is an accelerator for phenolic novolac and other epoxy cures. It acts as a cure accelerator. It offers advantages... view more
Amicure® PACM by Evonik is an unmodified cycloaliphatic amine based curing agent. It is suitable for adhesive applications. It possesses low viscosity and excellent mechanical properties following... view more
Amicure® TEDA by Evonik is a high-purity catalyst. It is designed for polyurethane applications. Amicure® TEDA consists of minimum 99.95% of triethylenediamine on a water-free, amine-base. It is... view more
Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient... view more
Amicure® UR-41 by Evonik acts as an accelerator for dicyandiamide cured epoxy resins. It provides longer pot life than standard substituted urea accelerators without increasing activation... view more
Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more
Amicure® UR10/30 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It acts as a curing agent. It provides rapid curing, high glass transition temperature, good... view more
Amicure® UR2T by Evonik is a substituted urea-based cure accelerator. It is used in one-pack paste and film adhesives. It possesses good flow properties. Amicure® UR2T offers benefits such as rapid... view more
Amicure® UR7/10 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It is a finely grounded version of Amicure® UR accelerator. It is supplied as a micro... view more
HyPrene Process Oils by Ergon
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