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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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1 202 products match your search
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Description
Modified ethylene vinyl acetate copolymer. Used as a sealing layer to film or sheet lidding applications. It provides a peelable seal to a number of materials including HDPE, LLDPE, LDPE and EVA. It... view more
Applications
Modified ethylene acrylate. Used as a sealing layer to film or sheet lidding applications. It provides a peelable seal to a number of materials including HDPE, LLDPE, LDPE and EVA. Suitable for use... view more
Applications
Eastman Optifilm™ Enhancer 300 by Eastman is a readily biodegradable, efficient, low odor, low toxicity, LVP-VOC, Non-HAP, Non-SARA, excellent retarder solvent & coalescent. It shows broad compatibility, easy... view more
Eastman Optifilm™ Enhancer 400 by Eastman is a readily biodegradable, efficient, low odor, low toxicity, LVP-VOC, non-HAP, non-yellowing, non-SARA, excellent retarder solvent & coalescent. It is a low odor... view more
Eastman™ 2-Ethylhexanol by Eastman is a biodegradable, versatile solvent that features excellent reactivity as a chemical intermediate. It offers defoaming, wetting, and dispersing characteristics. It... view more
Eastman™ Butyl Acetate by Eastman is a readily biodegradable, medium boiling ester solvent. It offers good solvent activity, high electrical resistance and low MIR value, surface tension and water solubility... view more
Eastman™ DB by Eastman is a readily biodegradable, solvent & efficient coalescent. It shows good coupling efficiency, solvent activity, high blush resistance & dilution ratio. It exhibits slow... view more
Elementis
BENTONE® 54 by Elementis acts as a rheology modifier. It is an organic derivative of bentonite clay. It is designed for low to intermediate polarity organic systems. It provides increased viscosity... view more
Elementis
BENTONE® DS by Elementis is a beneficiated hectorite clay used as a rheology modifier for water-borne adhesives. Improves flow properties, surface quality and slump/ sag resistance, and reduces... view more
Elementis
DAPRO® DF 21 by Elementis is a blend of hydrophobic silica, emulsifiers and mineral oil. Acts as a defoamer readily dispersible in water. Suitable for water-borne adhesives. Typically used at... view more
Elementis
DAPRO® DF 420 by Elementis is a water dispersible, non-explosive defoamer. Exhibits excellent persistence and compatibility. Suitable for aqueous adhesives. Complies with REACH, TSCA, EINECS, DSL... view more
Elementis
RHEOLATE® 175 rheological additive by Elementis is a low viscosity, easy-to-use hydrophobically modified alkali-swellable emulsion (HASE). It is APEO (alkyl phenol ethoxylate)- and solvent- free... view more
Elkem Silicones
Bluesil™ PRIM 131 by Elkem Silicones acts as an adhesion promoter. It is used for room temperature vulcanizing silicone elastomers, polyamide, polycarbonate and ABS. It is suitable for one-component... view more
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling... view more
Amicure® CG-1200G by Evonik is a micronized grade of dicyandiamide. It contains 0.5% of an inert flow control additive to inhibit clumping and improve handling. It acts as a latent curing agent. Its... view more
AMICURE® CG-1400 by Evonik acts as a curing agent. It is a micronized grade of dicyandiamide containing 0.5% of an inert flow control additive to inhibit clumping and improve handling. It is... view more
AMICURE® CG-325 by Evonik is a pulverized grade of dicyandiamide. It offers benefits such as enhanced reactivity, improved product consistency and reduced clumping. AMICURE® CG-325 is used as a curing agent... view more
Amicure® CG-325G is a micronized grade of dicyandiamide. It acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. It contains 1.5% of an inert flow... view more
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