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Product Name
Supplier
Description
Cardolite® Ultra LITE 513
Cardolite
Cardolite® Ultra LITE 513 by Cardolite is a low viscosity, mono-functional epoxy reactive diluent. The long hydrophobic aliphatic side chain of cardanol gives this product a very low viscosity and...
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Applications
Adhesives
Buildings & constructions
Industrial Assembly
Transportation (excl. Automotive)
...
6
Documents
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Cardolite® LITE 513E
Cardolite
Cardolite® LITE 513E is an epoxy reactive diluent. It contains low total chlorine/halogen content (= 1000ppm) and exhibits low color & low viscosity. This glycidyl ether offers reduced shrinkage...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
5
Documents
Contact
Get Sample
Cardolite® NX-5607
Cardolite
Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Buildings & constructions>Concrete
...
5
Documents
Contact
Get Sample
Cardolite® NX-5608
Cardolite
Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Transportation (excl. Automotive)
...
5
Documents
Contact
Get Sample
Cardolite® Ultra LITE 2009
Cardolite
Cardolite® Ultra LITE 2009 is a very low viscosity and very light color phenalkamine epoxy curing agent (Gardener 1) that contains benzyl alcohol. It is specifically designed for improved color...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)
Electrical & Electronic Bonding>Poting & Encapsulating
...
2
Documents
Contact
Get Sample
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all Cardolite
products matching your search
Technicure® EMI-24-CN
A&C Catalysts
1-(2-Cyanoethyl)-2-ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It appears as amber to brownish liquid. It is used for impact and heat resistant adhesives, and accelerator...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
AFC ACCELERATOR™ AMC-2
AMPAC Fine Chemicals
It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. The speed and specificity of this grade makes it relatively easy to incorporate dimer, trimer, and other polybasic...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Buildings & constructions>Structural assembly
...
AFC ACCELERATOR™ ATC-3
AMPAC Fine Chemicals
It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. At elevated temperatures, it gives three to four times the rate of reaction of common promoters such as tertiary...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Aqualac AYD-127
Aquent Advance Material Technologies
Aqualac AYD-127 by Aquent Advance Material Technologies is bis-phenol A epoxy resin. It is a colorless or yellow viscous liquid with low toxicity. It can be modified to meet a wide variety of bonding needs. Generally, epoxy bonds...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
Ricon® 184MA6
Cray Valley (TotalEnergies)
Ricon® 184MA6 by Cray Valley (TotalEnergies) is a is a low molecular weight polybutadiene-styrene copolymer functionalized with maleic anhydride. It is recommended for use in sealants and pressure sensitive and...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-4032D
DIC Corporation
EPICLON® HP-4032D by DIC Corporation is a high performance distilled naphthalene-based epoxy resin. It is a distilled product designed for liquid encapsulant applications in adhesives. Offers...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-4700
DIC Corporation
EPICLON® HP-4700 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4700 combines...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-4770
DIC Corporation
EPICLON® HP-4770 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4770 combines...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-5000
DIC Corporation
EPICLON® HP-5000 by DIC Corporation is a high performance epoxy resin with modified polyfuctional-type naphthalene backcone. Provides ductility and flexible toughness. It improves hard and brittle...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-6000
DIC Corporation
EPICLON® HP-6000 by DIC Corporation is a flame retardant, high performance epoxy resin with naphthalene backcone. Provides low thermal expansion, ductility and flexible toughness. It improves hard...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
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PE 7600
Electrolube
PE 7600 by Electrolube is a polyester resin. Acts as a flame retardant. Eliminates the use of harmful isocyanates without compromising performance, to create a completely hazard free environment...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
Bluesil™ ESA 7252 A & B
Elkem Silicones
Bluesil™ ESA 7252 A & B by Elkem Silicones is a low viscosity , non-corrosive, two-component silicone elastomer which cures at room temperature by a polyaddition reaction. It is supplied in the form...
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Applications
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Fumed Silica
Elkem Silicones
Fumed silica acts as rheological modifier. It is applied in production of RTV silicone rubber, silicone neutral glue in construction industry. It has applications in capacitor encapsulants for...
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Applications
Adhesives
Polymers>Silicones (Si)
Transportation (excl. Automotive)>Aircraft & Aerospace
Buildings & constructions
...
SUPER SAP® CCR/CCF
Entropy Resins
Epoxy system made of liquid epoxy resin mixed with fast hardener. It contains bio renewable materials sourced as co-products or waste streams of other industrial processes, such as wood pulp and bio...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
SUPER SAP® CCR/CCS
Entropy Resins
Epoxy system made of liquid epoxy resin mixed with slow hardener. It contains bio renewable materials sourced as co-products or waste streams of other industrial processes, such as wood pulp and bio...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
AMICURE® 101
Evonik
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1769
Evonik
ANCAMINE® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. It is suitable for potting and casting adhesives. It possesses good mechanical- and electrical properties. It provides low...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1922A
Evonik
ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Transportation (excl. Automotive)>Aircraft & Aerospace
...
ANCAMINE® 2264
Evonik
ANCAMINE® 2264 by Evonik is an epoxy curing agent with both cycloaliphatic and aromatic amine. It provides increased chemical resistance and faster cure. It possesses higher glass transition...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 2709
Evonik
Ancamine® 2709 by Evonik acts as a tertiary amine based cure accelerator for dicyandiamide and anhydride cured epoxy resin systems. It offers rapid cure at elevated temperatures, low viscosity and...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
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DMS -H03
Gelest (Mitsubishi Chemical)
DMS -H03 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H11
Gelest (Mitsubishi Chemical)
DMS -H11 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H21
Gelest (Mitsubishi Chemical)
DMS -H21 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H25
Gelest (Mitsubishi Chemical)
DMS -H25 by Gelest (Mitsubishi Chemical) is hydride terminated polydimethylsiloxane. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H31
Gelest (Mitsubishi Chemical)
DMS -H31 by Gelest (Mitsubishi Chemical) is Poly (dimethylsiloxane) hydride terminated. This polymer undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
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all Gelest (Mitsubishi Chemical)
products matching your search
HP6206
Guangdong HaoHui New Materials
HP6206 by Guangdong HaoHui New Materials is aliphatic urethane acrylate. It is a highly flexible oligomer offering good weatherability. It exhibits good adhesion & flexibility and non-yellowing properties. It is...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
Accelerator 1573
Huntsman
Accelerator 1573 by Huntsman is a homogeneous, agglomerate-free dispersion of DICY in liquid epoxy resin. It acts as an accelerator. Easy to manipulate and introduce in epoxy resins formulations...
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Applications
Adhesives
Polymers>Epoxies (EP)
Medical>Medical device assembly
Automotive>Exterior vehicle (OEM)
...
Accelerator 2950
Huntsman
Accelerator 2950 by Huntsman Advanced Materials acts as an effective accelerator. It is a co-reacting tertiary amine-based accelerator with low plasticizing effect. It is also used as co-hardener...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Marine
Buildings & constructions>Structural assembly
...
Accelerator 3130
Huntsman
Accelerator 3130 by Huntsman is a non-amine accelerator dissolved in ethanol. It is ideal as drop-in accelerator to cope with cold weather. The ratio of resin to hardener remains unchanged...
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Applications
Adhesives
Polymers>Epoxies (EP)
Polymers>Amines
Medical>Medical device assembly
...
Accelerator 400
Huntsman
Accelerator 400 by Huntsman acts as a curing agent. It is compatible with most amines and can be used in amine-cured epoxy systems. Accelerator 400 is recommended for flooring & potting...
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Applications
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Accelerator 960-1
Huntsman
Accelerator 960-1 by Huntsman Advanced Materials acts as an accelerator and curing agent. It is low viscosity tertiary amine co-hardener or accelerator for ambient cure epoxy systems based on...
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Applications
Adhesives
Polymers>Epoxies (EP)
Medical>Medical device assembly
Transportation (excl. Automotive)>Truck
...
View
all Huntsman
products matching your search
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