BYK® -088 by BYK is a solution of foam-destroying polymers and polysiloxanes. Acts as a defoamer for all solvent-borne and solvent-free adhesives and sealants, especially aromatic-free systems. BYK®... view more

BYK® -1790 by BYK is a silicon-free, polymer-based defoamer. It is recommended for solvent-free-, radiation-curing (UV "> It has no negative effect on the adhesive properties of the... view more

BYK® -307 by BYK is a polyether-modified polydimethylsiloxane. Acts as a surfactant and a wetting agent. It is suitable for aqueous systems and recommended for solvent-borne systems. Can be used for... view more

BYK® -333 by BYK is polyether-modified polydimethylsiloxane. Acts as a silicone based surfactant and a wetting agent. It is recommended for solvent-borne, solvent-free and aqueous systems... view more

BYK®-3764 by BYK is polyether-modified polydimethylsiloxane-based surface additive. It offers moderate to high reduction in surface tension that provides excellent substrate wetting. It displays... view more

DESMODUR® E 210 is a solvent-free aromatic polyisocyanate prepolymer by Covestro. It is based on diphenylmethane diisocyanate (MDI). DESMODUR® E 210 is used in reactive adhesives and sealants and in... view more

Aromatic polyisocyanate prepolymer based on diphenylmethane 4,4'- diisocyanate (MDI). Used in reactive adhesives and sealants... view more

It is a silane terminated polyurethane prepolymer. Desmoseal® S XP 2458 is used as a base resin in solvent-free, moisture-curing one-pack systems. These systems cure without bubbles or blisters if... view more

MONDUR® MA 2904 by Covestro is an isocyanate-terminated(MDI) prepolymer mixed with and allophanate modified 4,4’ – diphenylmethane diisocyanate(MDI). Used in reactive adhesives and sealants... view more

Deuterol® 201 E by Deuteron is a non-ionigenic surfarce-active compound in combination with water miscible solvents. Acts as defoaming wetting and dispersing agent for water dilutable systems... view more

Ancamide® 3529 by Evonik is a low viscosity amidoamine hardener. It is recommended for high temperature applications such as sealants, epoxy mortars and reactive adhesives. It offers very long pot... view more

DYNACOLL® 7110 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging, textile and... view more

DYNACOLL® 7111 by Evonik is a saturated polyester. It shortens open time and increases initial strength, melt viscosity, and adhesion to polar substrates. DYNACOLL® 7111 is used in hot melt... view more

DYNACOLL® 7130 by Evonik is a linear, saturated, amorphous copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding... view more

DYNACOLL® 7131 by Evonik is an amorphous, saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging... view more