BYK® -065 by BYK is a solution of foam-destroying polysiloxanes. Acts as a defoamer. This additive contains fluoro-modified silicone. It is preferably used in the chlorinated rubber, vinyl and... view more

BYK® -066 N by BYK is a solution of foam-destroying polysiloxanes. Acts as a defoamer. This additive contains fluoro-modified silicone. The binders preferred for it are chlorinated rubber and... view more

BYK® -067 A by BYK is a non-aqueous emulsion of a foam-destroying polysiloxane. Acts as a defoamer. In BYK® -067 A, separation or turbidity may occur at temperatures below 5°C. This additive is odor... view more

BYK®-3764 by BYK is polyether-modified polydimethylsiloxane-based surface additive. It offers moderate to high reduction in surface tension that provides excellent substrate wetting. It displays... view more

BYK® -A 535 by BYK is a solution of foam-destroying polymers, silicone-free. Acts as a air release agent. It eliminates air bubbles and ensures pinhole-free surfaces. In transparent systems it can... view more

Chartwell C-523.71HR by Chartwell International is an increased reactivity hybrid carboxy/ hydroxy functional metal organic adhesion promoter synthesized with a stabilized neutralized metal complex. It provides improved... view more

Ancamide® 3011 by Evonik is a high viscosity polyamide. It acts as a curing agent for solid epoxy resins. It offers high performance corrosion resistance, good flexibility and long pot life... view more

Ancamide® 3015 by Evonik is a high viscosity polyamide solution in xylene. It acts as a curing agent for solid epoxy resins. It provides good flexibility, high performance corrosion resistance and... view more

Ancamide® 3021 by Evonik is a medium viscosity polyamide. It is recommended for use with liquid epoxy resin. It acts as a curing agent. It offers good adhesion to cementitious substrates. Ancamide®... view more

Ancamide® 3029 by Evonik is a polyamide. It acts as a curing agent. It offers low viscosity, moderate pot life and good adhesion to concrete. Ancamide® 3029 is recommended for reactive adhesives and... view more

Ancamide® 3030 by Evonik is a reactive polyaminoamide developed for use in liquid epoxy resins. It offers low viscosity, moderate pot life and good adhesion. It acts as a curing agent. Ancamide®... view more

ERISYS® GE-10 by Huntsman is a low viscosity, aromatic, mono-epoxide, ortho cresol glycidyl ether. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses... view more

ERISYS® GE-21 by Huntsman is low viscosity, aliphatic, diepoxide, epoxidized butanediol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses compatibility at... view more