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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Dicyanex®

Adhesives ingredients supplied by Evonik

5 products match your search
Product Name
Supplier
Description
DICYANEX® 1400F by Evonik acts as a latent curing agent for epoxy resins. Provides easy variation of activation temperature from 180°C-95°C with appropriate accelerator selection. It is easily... view more
Applications
Dicyanex® 1200 by Evonik is a micronized grade of dicyandiamide. It contains 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing... view more
Dicyanex® 1400B by Evonik is a micronized grade of dicyandiamide. It contains 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing... view more
Applications
Dicyanex® 200-X by Evonik is a dicyandiamide latent curing agent used for epoxy resins in solvent-based processes. It provides enhanced solubility in polar solvents. Dicyanex® 200-X is used in... view more
Dicyanex® 325 by Evonik is a pulverized grade of dicyandiamide. It contains 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing... view more
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