EPICLON®

EPICLON® 153 by DIC Corporation is an epoxy resin based on tetrabromobisphenol A grade. Acts as an excellent flame retardant. EPICLON® 153 is used in adhesive applications... view more

EPICLON® 1650-75MPX by DIC Corporation is a flexible epoxy resin. It can be diluted in xylene/ methoxypropanol solution. Exhibits improved impact resistance. EPICLON® 1650-75MPX is used in adhesive... view more

EPICLON® 840 by DIC Corporation is a low viscosity bisphenol A type (BPA) epoxy resin. Available in Asian countries. Applications of EPICLON® 840 by DIC Corporation include concrete adhesives... view more

EPICLON® 850 by DIC Corporation is a standard bisphenol A type (BPA) epoxy resin. Available in Asian countries. Applications of EPICLON® 850 by DIC Corporation include concrete adhesives... view more

EPICLON® 850-CRP by DIC Corporation is a distilled bisphenol A type (BPA) epoxy resin of high purity. Available in Asian countries. Applications of EPICLON® 850-CRP by DIC Corporation include... view more

EPICLON® 850-S by DIC Corporation is a bisphenol A type (BPA) epoxy resin containing low hydrolyzable chlorine. Available in Asian countries. Applications of EPICLON® 850-S by DIC Corporation... view more

EPICLON® 860 by DIC Corporation is a bisphenol A (BPA) epoxy resin. EPICLON® 860 is used in adhesive applications... view more

EPICLON® EXA-4816 by DIC Corporation is an epoxy resin with high purity. Exhibits excellent flexible toughness, high strength and elongation rate at normal temperatures. Offers tough physical... view more

EPICLON® EXA-4850-1000 by DIC Corporation is a high performance liquid epoxy resin with ductility and flexible toughness. It combines exceptionally good bonding properties and extremely small cure... view more

EPICLON® EXA-4850-150 by DIC Corporation is a high performance liquid epoxy resin with flexible toughness and ductility. It improves hard and brittle properties. It combines exceptionally good... view more

EPICLON® HP-4032D by DIC Corporation is a high performance naphthalene based epoxy resin. It is a distilled product. Designed for liquid encapsulant applications. EPICLON® HP-4032D offers ductility... view more

EPICLON® HP-4700 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4700 combines... view more

EPICLON® HP-4770 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4770 combines... view more

EPICLON® HP-5000 by DIC Corporation is a high performance epoxy resin with modified polyfuctional-type naphthalene backcone. Provides ductility and flexible toughness. It improves hard and brittle... view more

EPICLON® HP-6000 by DIC Corporation is a flame retardant, high performance epoxy resin with naphthalene backcone. Provides low thermal expansion, ductility and flexible toughness. It improves hard... view more

EPICLON® HP-7200 by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Exhibits ductility and flexible toughness. It combines exceptionally good bonding properties and... view more

EPICLON® HP-7200H by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Possesses ductility and flexible toughness. It combines exceptionally good bonding properties and... view more

EPICLON® HP-7200HH by DIC Corporation is a high performance dicyclopentadiene based epoxy resin. Designed for use in IC encapsulant and adhesives. Exhibits ductility and flexible toughness. EPICLON®... view more

EPICLON® HP-7200HHH by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Offers ductility and flexible toughness. It combines exceptionally good bonding properties and... view more

EPICLON® HP-7200L by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Designed for IC encapsulant applications. EPICLON® HP-7200L exhibits ductility and flexible toughness... view more

EPICLON® HP-820 by DIC Corporation is a high performance liquid epoxy resin with alkyl phenol. Designed for use in adhesive applications. Exhibits ductility and flexible toughness. EPICLON® HP-820... view more

EPICLON® TSR-601 by DIC Corporation is a modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. EPICLON® TSR-601 by DIC Corporation sed in elastomeric... view more

EPICLON® TSR-960 by DIC Corporation is a modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. EPICLON® TSR-960 by DIC Corporation is used in elastomeric... view more

Alkyl phenol mono glycidyl ether. Acts as a reactive diluent. It is a 100% reactive system. Exhibits super low viscosity and also achieves very low viscosity when mixed with liquid epoxy resins... view more

Bisphenol F type epoxy resin. It is a liquid resin having excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more

Bisphenol F type epoxy resin. It is a liquid resin containing low hydrolyzable chlorine content. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete... view more

Bisphenol F type epoxy resin. It has low tendency for crystallization. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more

Bisphenol A type (BPA) epoxy resin. It is a liquid resin comprising low hydrolyzable chlorine. Available in Asian countries. Applications include concrete adhesives... view more

Bisphenol A type (BPA) epoxy resin. It is a liquid resin which exhibits low tendency to crystallize. Available in Asian countries. Applications include concrete adhesives... view more

Epoxy resin diluted with butyl glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives... view more

Epoxy resin diluted with alkyl phenol mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives... view more

Polyamine (amide amine). Acts as a curing agent. Offers high strength. Suitable for low temperature applications. Applications include concrete adhesives... view more

Epoxy resin diluted with alkyl phenol mono-glycidyl ether and alkyl mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications... view more

Epoxy resin diluted with 1, 6-hexanediol diglycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives... view more

Bisphenol F type epoxy resin. It is a resin of high purity. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more

Bisphenol F type epoxy resin. It is a resin of high purity. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more

Epoxy phenol novolac. It is a multi-functional resin produced by reaction of phenol with formaldehyde and subsequent glycidylation with epichlorohydrin. Exhibits high heat resistance. Used in... view more