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Adhesives & Sealants Selector
DIC Corporation
EPICLON®
by SpecialChem
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EPICLON®
Adhesives ingredients supplied by DIC Corporation
37
products match your search
Detailed
List
Product Name
Supplier
Description
EPICLON® 153
DIC Corporation
EPICLON® 153 by DIC Corporation is an epoxy resin based on tetrabromobisphenol A grade. Acts as an excellent flame retardant. EPICLON® 153 is used in adhesive applications...
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Applications
Adhesives
Polymers>Epoxies (EP)
EPICLON® 1650-75MPX
DIC Corporation
EPICLON® 1650-75MPX by DIC Corporation is a flexible epoxy resin. It can be diluted in xylene/ methoxypropanol solution. Exhibits improved impact resistance. EPICLON® 1650-75MPX is used in adhesive...
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Applications
Adhesives
EPICLON® 840
DIC Corporation
EPICLON® 840 by DIC Corporation is a low viscosity bisphenol A type (BPA) epoxy resin. Available in Asian countries. Applications of EPICLON® 840 by DIC Corporation include concrete adhesives...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® 850
DIC Corporation
EPICLON® 850 by DIC Corporation is a standard bisphenol A type (BPA) epoxy resin. Available in Asian countries. Applications of EPICLON® 850 by DIC Corporation include concrete adhesives...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® 850-CRP
DIC Corporation
EPICLON® 850-CRP by DIC Corporation is a distilled bisphenol A type (BPA) epoxy resin of high purity. Available in Asian countries. Applications of EPICLON® 850-CRP by DIC Corporation include...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® 850-S
DIC Corporation
EPICLON® 850-S by DIC Corporation is a bisphenol A type (BPA) epoxy resin containing low hydrolyzable chlorine. Available in Asian countries. Applications of EPICLON® 850-S by DIC Corporation...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® 860
DIC Corporation
EPICLON® 860 by DIC Corporation is a bisphenol A (BPA) epoxy resin. EPICLON® 860 is used in adhesive applications...
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Applications
Adhesives
EPICLON® EXA-4816
DIC Corporation
EPICLON® EXA-4816 by DIC Corporation is an epoxy resin with high purity. Exhibits excellent flexible toughness, high strength and elongation rate at normal temperatures. Offers tough physical...
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Applications
Adhesives
EPICLON® EXA-4850-1000
DIC Corporation
EPICLON® EXA-4850-1000 by DIC Corporation is a high performance liquid epoxy resin with ductility and flexible toughness. It combines exceptionally good bonding properties and extremely small cure...
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Applications
Adhesives
EPICLON® EXA-4850-150
DIC Corporation
EPICLON® EXA-4850-150 by DIC Corporation is a high performance liquid epoxy resin with flexible toughness and ductility. It improves hard and brittle properties. It combines exceptionally good...
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Applications
Adhesives
EPICLON® HP-4032D
DIC Corporation
EPICLON® HP-4032D by DIC Corporation is a high performance naphthalene based epoxy resin. It is a distilled product. Designed for liquid encapsulant applications. EPICLON® HP-4032D offers ductility...
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Applications
Adhesives
EPICLON® HP-4700
DIC Corporation
EPICLON® HP-4700 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4700 combines...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-4770
DIC Corporation
EPICLON® HP-4770 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4770 combines...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-5000
DIC Corporation
EPICLON® HP-5000 by DIC Corporation is a high performance epoxy resin with modified polyfuctional-type naphthalene backcone. Provides ductility and flexible toughness. It improves hard and brittle...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-6000
DIC Corporation
EPICLON® HP-6000 by DIC Corporation is a flame retardant, high performance epoxy resin with naphthalene backcone. Provides low thermal expansion, ductility and flexible toughness. It improves hard...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-7200
DIC Corporation
EPICLON® HP-7200 by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Exhibits ductility and flexible toughness. It combines exceptionally good bonding properties and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-7200H
DIC Corporation
EPICLON® HP-7200H by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Possesses ductility and flexible toughness. It combines exceptionally good bonding properties and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-7200HH
DIC Corporation
EPICLON® HP-7200HH by DIC Corporation is a high performance dicyclopentadiene based epoxy resin. Designed for use in IC encapsulant and adhesives. Exhibits ductility and flexible toughness. EPICLON®...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-7200HHH
DIC Corporation
EPICLON® HP-7200HHH by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Offers ductility and flexible toughness. It combines exceptionally good bonding properties and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-7200L
DIC Corporation
EPICLON® HP-7200L by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Designed for IC encapsulant applications. EPICLON® HP-7200L exhibits ductility and flexible toughness...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-820
DIC Corporation
EPICLON® HP-820 by DIC Corporation is a high performance liquid epoxy resin with alkyl phenol. Designed for use in adhesive applications. Exhibits ductility and flexible toughness. EPICLON® HP-820...
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Applications
Adhesives
EPICLON® TSR-601
DIC Corporation
EPICLON® TSR-601 by DIC Corporation is a modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. EPICLON® TSR-601 by DIC Corporation sed in elastomeric...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® TSR-960
DIC Corporation
EPICLON® TSR-960 by DIC Corporation is a modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. EPICLON® TSR-960 by DIC Corporation is used in elastomeric...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® 520
DIC Corporation
Alkyl phenol mono glycidyl ether. Acts as a reactive diluent. It is a 100% reactive system. Exhibits super low viscosity and also achieves very low viscosity when mixed with liquid epoxy resins...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® 830
DIC Corporation
Bisphenol F type epoxy resin. It is a liquid resin having excellent workability and moldability due to low viscosity. Applications include concrete adhesives...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® 830-S
DIC Corporation
Bisphenol F type epoxy resin. It is a liquid resin containing low hydrolyzable chlorine content. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® 835
DIC Corporation
Bisphenol F type epoxy resin. It has low tendency for crystallization. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® 840-S
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a liquid resin comprising low hydrolyzable chlorine. Available in Asian countries. Applications include concrete adhesives...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® 850-LC
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a liquid resin which exhibits low tendency to crystallize. Available in Asian countries. Applications include concrete adhesives...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® 855
DIC Corporation
Epoxy resin diluted with butyl glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® 857
DIC Corporation
Epoxy resin diluted with alkyl phenol mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® B-065
DIC Corporation
Polyamine (amide amine). Acts as a curing agent. Offers high strength. Suitable for low temperature applications. Applications include concrete adhesives...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® D-591
DIC Corporation
Epoxy resin diluted with alkyl phenol mono-glycidyl ether and alkyl mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® D-595
DIC Corporation
Epoxy resin diluted with 1, 6-hexanediol diglycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® EXA-830LVP
DIC Corporation
Bisphenol F type epoxy resin. It is a resin of high purity. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® EXA-835LV
DIC Corporation
Bisphenol F type epoxy resin. It is a resin of high purity. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives...
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Applications
Adhesives
Buildings & constructions>Concrete
EPICLON® N-740
DIC Corporation
Epoxy phenol novolac. It is a multi-functional resin produced by reaction of phenol with formaldehyde and subsequent glycidylation with epichlorohydrin. Exhibits high heat resistance. Used in...
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Applications
Adhesives
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