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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Genamid®

Adhesives ingredients supplied by BASF

5 products match your search
Product Name
Supplier
Description
Genamid® 2000 by BASF is amidoamine resin of moderately low viscosity. Used as a curing agent for liquid or solid epoxy resins in adhesives. Genamid® 2000 offers high chemical and water resistance... view more
Genamid® 235 by BASF is low viscosity amidoamine resin. Used as curing agent for solid or liquid epoxy resins. Offers good compatibility with a wide range of epoxy products. Suits for high solids... view more
Low viscosity amidoamine resin. Used as curing agent for solid or liquid epoxy resins in adhesives. Offers good compatibility with a wide range of epoxy products and is most commonly used with... view more
Low viscosity amidoamine resin. Reacts with solid or liquid epoxy resins. Can be used as all or part of the curing agent component in high solids adhesives and sealants. Provides long pot life... view more
Very low viscosity amidoamine resin. Used as curing agent for solid or liquid epoxy resins in adhesives. Suits for high solids formulations with low viscosity... view more
Nagase Water Soluble Epoxy Compounds
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